We are often called in by clients to troubleshoot production processes. By applying our extensive background in electronics production, our access to the latest analytical tools, and our ability to understand and empathise with our clients' challenges, we are often able to provide rapid and economic solutions. Here are three example case studies.

Case study 1

Problem:

A client had moved manufacturing and assembly of their printed circuit boards from the UK to China. The client was having a substantial number of failures which appeared to be related to a small number of components in a specific region of the circuit board. These could be fixed by replacing the components using hand soldering, or even simply re-soldering the components.

Solution:

A detailed analysis of the solder joints coupled with a thermal analysis of the board showed that in parts of the board the solder had insufficiently re-flowed. These areas were close to larger components that provided heat sinking thus locally decreasing heating rate. In fact in specific regions, the board had not reached a sufficient temperature for correct re-flow. We were able to suggest process changes that our client passed on to their manufacturers in China. Problem solved.

Case study 2

Problem:

A different client had also outsourced very large volume production of a specific component to China. The components were subsequently soldered by our client into a safety critical subsystem. Although current supplies performed well, some previous batches had demonstrated problems with solderability, and our client had several million useless components in stock. They suspected that something had gone wrong with the manufacturing process, their manufacturer did not agree. We were called in to analyse the problem.  

Solution:

A quantitative analysis of the solderability combined with a metalurgical analysis of wire used in the component construction, SEM microscopy and EDAX elemental mapping showed that there had been a problem with the original tinning of the wire used in the component construction. This had induced surface micro-cracks and contamination which was responsible for the problem. Our client was thus able to go back to the manufacturer with clear evidence of where lay the problem.

Case study 3

Problem:

It was suspected that a testing procedure used by a client to detect faulty components was in fact temporarily 'healing' specific defects that would result in costly premature field failures.

Solution:

Detailed impedance analysis of the components showed that in cases where a thin oxide interface between two conductors was responsible for an open circuit, the testing procedure used by our clients did indeed punch through the oxide to produce a seemingly good component, however the heal was only temporary and the conduction path would eventually become open circuit again. We were able to recommend alternative quality control procedures which eliminated the problem.

Facilities: Through our close connection with several local universities combined with our own facilities we have access to a very wide range of analytical techniques that we bring to bear on these and similar problems. Examples are Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Analysis (EDAX), Transmission Electron Microscopy (TEM), Atomic Force Microscopy (AFM), Micro-focus X-ray, Scanning Acoustic Microscopy (SAM), Impedance Spectroscopy and many more.

If you are having difficulties that might yield to our skills and expertise, then why not contact us to talk about it?