We are often called upon to look at board
and assembly problems. Recent jobs have included:
-
Examination of cracking of component
leads
-
Surface mount soldering problems in
imported boards
-
Fault tracing
-
Leadframe fracture during
manufacturing
-
Solder materials and processes
Through
our links with the local universities, we have access to all the
latest analytical tools, including SEM, TEM, AFM, SAM, MFX-ray etc. Contact
us if you have board and assembly problems that need solving.
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