We are often called upon to look at board and assembly problems. Recent jobs have included:

• Examination of cracking of component leads

• Surface mount soldering problems in imported boards

• Fault tracing

• Leadframe fracture during manufacturing

• Solder materials and processes

Through our links with the local universities, we have access to all the latest analytical tools, including SEM, TEM, AFM, SAM, MFX-ray etc.

Contact us if you have board and assembly problems that need solving.